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Brand Name : XCE
Model Number : XCE kld
Certification : CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin : China
MOQ : MOQ 1 Piece
Price : Negotiation
Payment Terms : T/T, Western Union
Supply Ability : 1000000 pieces per week
Delivery Time : 5-10 working days
Packaging Details : 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color : Green
Material : Rogers Material
Layer : Multialyer
Board Size : 56*40cm
Copper Thinknes : 1 oz
Min Line Width : 4 mil
Min Line Space : 4mil
Surface Finish : Gold Finger
Name : Rogers pcb
Multilayer RF Pcb Board With FM Power Amplifier Satellite Transceiver 2.4 GHz ER 3.38
Products Details
| Raw Material | Rogers |
| Layer Count | Multilayer |
| Board Thickness | 1.6 mm |
| Copper Thickness | 1.0oz |
| Surface Finish | Gold Finger |
| Solder Mask | Black |
| Silkscreen | White |
| Min. Trace Width/Spacing | 0.075/0.075mm |
| Min. Hole Size | 0.25mm |
| Hole Wall Copper Thickness | ≥20μm |
| Measurement | 560*400mm |
| Packaging | Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps |
| Application | Communication,automobile,cell,computer,medical |
| Advantage | Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
| Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable |
| Certification | UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
PCB Capability
| Layer | 1-30L |
| Material | CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material,Copper Clad Laminate ,Rogers ,Neclo, Taconic and Isola pcb . |
| Board Thinckness | 0.2-6mm |
| Max Finish Size | 800*508mm |
| Min. Drill Hole Size | 0.25mm |
| Min. Line Width | 0.075mm(3mil) |
| Min. Line Spacing | 0.075mm(3mil) |
| Surface finish | HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
| Copper thickness | 0.5-4.0 Oz |
| Solder mask color | green/black/white/red/blue/yellow |
| Inner packing | Vacuum packing, Plastic Bag |
| Outer packing | standard carton packing |
| Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| Certificate | ISO9001,SGS |
| Profiling punching | Routing,V-CUT,Beveling |
Parameter:
Rogers 4003 C Pcb With 3.38 ER . There are 0.127 mm ,0.254 mm ,0.762 mm 0.508 mm 1.6 mm board thinckness with 1 oz , 2 oz ,3 oz .
Rogers 4350 B pcb With 3.5 ER . There are 0.127 mm ,0.254 mm ,0.762 mm 0.508 mm 1.6 mm board thinckness with 1 oz , 2 oz ,3 oz .
Rogers 5880 Pcb With 2.2 ER . There are 0.127 mm ,0.254 mm ,0.762 mm 0.508 mm 1.6 mm board thinckness with 1 oz,2 oz, 3 oz
Rogers 3003 Pcb With 3 ER . There are 0.127mm,0.508mm 0.762mm 1.6 mm 3 mm Board Thinckness with 1 oz ,2 oz , 3 oz .
Rogers 3010 Pcb With 10.2 ER . There are 0.635 mm Thinckness Board with 1 oz , 2 oz ,3 oz .
PrePreg Material
| Parameter | Value |
| Specific gravity/density | 1.850 g/cm3 (3,118 lb/cu yd) |
| Water absorption | −0.125 in < 0.10% |
| Temperature index | 140 °C (284 °F) |
| Thermal conductivity, through-plane | 0.29 W/(m·K), 0.343 W/(m·K) |
| Thermal conductivity, in-plane | 0.81 W/(m·K), 1.059 W/(m·K) |
| Rockwell hardness | 110 M scale |
| Bond strength | > 1,000 kg (2,200 lb) |
| Flexural strength (A; 0.125 in) - LW | > 440 MPa (64,000 psi) |
| Flexural strength (A; 0.125 in) - CW | > 345 MPa (50,000 psi) |
| Tensile strength (0.125 in) LW | > 310 MPa (45,000 psi) |
| Izod impact strength - LW | > 54 J/m (10 ft·lb/in) |
| Izod impact strength - CW | > 44 J/m (8 ft·lb/in) |
| Compressive strength - flatwise | > 415 MPa (60,200 psi) |
| Dielectric breakdown (A) | > 50 kV |
| Dielectric breakdown (D48/50) | > 50 kV |
| Dielectric strength | 20 MV/m |
| Relative permittivity (A) | 4.8 |
| Relative permittivity (D24/23) | 4.8 |
| Dissipation factor (A) | 0.017 |
| Dissipation factor (D24/23) | 0.018 |
| Dielectric constant permittivity | 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz |
| Glass transition temperature | Can vary, but is over 120 °C |
| Young's modulus - LW | 3.5×106 psi (24 GPa) |
| Young's modulus - CW | 3.0×106 psi (21 GPa) |
| Coefficient of thermal expansion - x-axis | 1.4×10−5 K−1 |
| Coefficient of thermal expansion - y-axis | 1.2×10−5 K−1 |
| Coefficient of thermal expansion - z-axis | 7.0×10−5 K−1 |
| Poisson's ratio - LW | 0.136 |
| Poisson's ratio - CW | 0.118 |
| LW sound speed | 3602 m/s |
| SW sound speed | 3369 m/s |
| LW Acoustic impedance | 6.64 MRayl |
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
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Multilayer RF Pcb Board With FM Power Amplifier Satellite Transceiver 2.4 GHz ER 3.38 Images |